What are Sputtering Targets?

Sputtering targets play a crucial role in the process of thin film deposition, a technique commonly referred to as sputter deposition. This method involves transforming solid target materials into fine particles through bombardment by gaseous ions. The resulting particles are then sprayed onto another surface, known as the substrate. Sputter deposition finds extensive application in the manufacturing of semiconductors and computer chips, with most targets being composed of metallic elements or alloys. In certain cases, ceramic targets are utilized to produce durable thin coatings for a variety of tools.

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The dimensions and shapes of sputtering targets can vary significantly based on the specific thin film being produced. Targets can be as small as less than an inch (2.5 cm) in diameter or as large as over one yard (0.9 m) in length for rectangular designs. When larger targets are needed, manufacturers often create segmented designs connected through specialized joints.

As technology evolves, sputtering systems—the equipment responsible for the thin film deposition—have diversified, leading to a broader range of target shapes and structures. Conventionally, sputtering targets are either circular or rectangular, but suppliers can accommodate custom shapes upon request. Some advanced sputtering systems necessitate rotating targets for improved deposition quality. These cylindrical targets offer numerous advantages, including enhanced deposition speeds, reduced heat damage, and increased surface area, ultimately enhancing their overall functionality.

The performance of sputtering target materials is influenced by a variety of factors, notably their composition and the type of ions utilized during the sputtering process. For thin films that require high structural integrity, a target material with high purity is essential. Argon is typically the preferred gas for initiating sputtering, although different noble gases such as neon and krypton may be more effective for specific molecules. Ensuring that the atomic weight of the gas ions closely matches the sputtering target molecules is vital for optimizing energy and momentum transfer, which in turn enhances the uniformity of the deposited thin film. Read More

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At our facility, we offer one of the most extensive selections of sputtering target materials available. Our inventory includes various geometries and sizes such as rings, S-Guns, circular, rectangular, triangular, and planar targets.

Most sputtering target materials can be customized into an array of shapes and dimensions. However, there are technical constraints regarding the maximum size possible for a single piece. In such cases, multi-segmented targets are fabricated, and each segment is assembled using butt or bevelled joints.

If you do not find the sputtering target material or optimal purity you need in our listings, please reach out to us.